JPS6322676Y2 - - Google Patents
Info
- Publication number
- JPS6322676Y2 JPS6322676Y2 JP15658483U JP15658483U JPS6322676Y2 JP S6322676 Y2 JPS6322676 Y2 JP S6322676Y2 JP 15658483 U JP15658483 U JP 15658483U JP 15658483 U JP15658483 U JP 15658483U JP S6322676 Y2 JPS6322676 Y2 JP S6322676Y2
- Authority
- JP
- Japan
- Prior art keywords
- mount frame
- adhesive tape
- opening
- semiconductor wafer
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002390 adhesive tape Substances 0.000 claims description 59
- 239000004065 semiconductor Substances 0.000 claims description 36
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 239000002344 surface layer Substances 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 claims 8
- 238000000034 method Methods 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15658483U JPS6063943U (ja) | 1983-10-07 | 1983-10-07 | 半導体ウエハ用マウントフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15658483U JPS6063943U (ja) | 1983-10-07 | 1983-10-07 | 半導体ウエハ用マウントフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6063943U JPS6063943U (ja) | 1985-05-07 |
| JPS6322676Y2 true JPS6322676Y2 (en]) | 1988-06-22 |
Family
ID=30345467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15658483U Granted JPS6063943U (ja) | 1983-10-07 | 1983-10-07 | 半導体ウエハ用マウントフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6063943U (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4693545B2 (ja) * | 2005-08-16 | 2011-06-01 | 信越ポリマー株式会社 | 半導体ウェーハのダイシング用フレーム |
| JP5004515B2 (ja) * | 2006-06-16 | 2012-08-22 | 信越ポリマー株式会社 | キャリア治具 |
| JP5636266B2 (ja) * | 2010-11-16 | 2014-12-03 | 株式会社ディスコ | ワークの加工方法及びダイシングテープ |
-
1983
- 1983-10-07 JP JP15658483U patent/JPS6063943U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6063943U (ja) | 1985-05-07 |
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